In this study, a new type of microporous
surface for copper foam was prepared using an improved electroplating method.
Further, the microstructure of the microporous surface of copper foam was
evaluated using a scanning electron microscope (SEM). In the experiment,
deionized water was used as the working medium to investigate the pool boiling
heat transfer characteristics of smooth and microporous surfaces, thereby
obtaining their pool boiling heat transfer curves. Results show that under identical
heat flux conditions, the vaporization core of the microporous surface has a
high density in the nucleate boiling zone, which can effectively reduce the
superheat associated with the initial boiling point of the wall and
considerably increase the pool boiling heat transfer coefficient. Thus, this
study proves that the microporous surface of copper foam can be used for the
heat dissipation of high-power electronic devices such as semiconductor
refrigeration systems.