Abstract:

In this study, a new type of microporous surface for copper foam was prepared using an improved electroplating method. Further, the microstructure of the microporous surface of copper foam was evaluated using a scanning electron microscope (SEM). In the experiment, deionized water was used as the working medium to investigate the pool boiling heat transfer characteristics of smooth and microporous surfaces, thereby obtaining their pool boiling heat transfer curves. Results show that under identical heat flux conditions, the vaporization core of the microporous surface has a high density in the nucleate boiling zone, which can effectively reduce the superheat associated with the initial boiling point of the wall and considerably increase the pool boiling heat transfer coefficient. Thus, this study proves that the microporous surface of copper foam can be used for the heat dissipation of high-power electronic devices such as semiconductor refrigeration systems.

Key words: pool boiling, heat transfer enhancement; microporous surface;degree of superheat, heat transfer coefficient