多孔挤压铝扁管电子芯片热沉的热性能研究

doi:10.3976/j.issn.1002-4026.2018.03.007

Abstract

Abstract:

This study proposed a new kind of mini/microchannel heat sink fabricated by flat aluminum multiport extruded tubes, which was reliable for structure and simple for manufacturing process. In order to investigate the thermal characteristics of heat sinks, a threedimensional conjugated heat transfer model was developed. Meanwhile, an experiment was conducted to verify the reliability of the model, which included channel aspect ratio, channel width ratio and channel number on thermal resistance under pumping power consumption(Ω=0.03 W). In addition, the overall resistance of heat sink was divided into three parts (conduction resistance, convective resistance, and heat capacity resistance) and calculated in detail. Moreover, the effect of width and height of fins on enhancement of heat transfer factor (PEC) was discussed, and the optimized width of fins was calculated. This study provides a reference for the design of this kind of heat sink.

Key words: flat aluminum multiport extruded tubes, thermal resistance, mini/microchannel heat sink, longitudinal fins, numerical simulation

CLC Number:

TM 912.9

TANG Sheng,ZHAO Yao-hua， DIAO Yan-hua,QUAN Zhen-hua. Thermal performance of a new kind of heat sink fabricated by flat aluminum multiport extruded tubes for electronic devices cooling[J].SHANDONG SCIENCE, 2018, 31(3): 39-47.

References

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Thermal performance of a new kind of heat sink fabricated by flat aluminum multiport extruded tubes for electronic devices cooling

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