多孔挤压铝扁管电子芯片热沉的热性能研究
唐晟，赵耀华，刁彦华，全贞花
Thermal performance of a new kind of heat sink fabricated by flat aluminum multiport extruded tubes for electronic devices cooling
TANG Sheng,ZHAO Yao-hua， DIAO Yan-hua,QUAN Zhen-hua
山东科学
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2018, (3): 39
-47
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DOI: 10.3976/j.issn.1002-4026.2018.03.007
